The following products from Fujibo
categorize themselves as high stock removal pads.
These pads main application are for wafer polishing, glass polishing,
hard disk, stainless steel, and copper sheet polishing.
POLYPAS #55 is a multi-purpose pad is used for low-pressure
polishing.
This product main application is especially for glass polishing because
it provides excellent flatness when used in the second polishing stage
(following a first stage polishing with a harder pad).
POLYPAS #65 is a semi-soft type pad used for both low-
and medium pressure polishing.
This product main application is especially in the first stage of polishing
of silicon and GaAs wafers, photomask, and liquid crystal; providing scratch-free
and haze-free results.
POLYPAS #75 is a standard pad used for medium-pressure
polishing.
This product is designed to provide excellent flatness with pressure ranging
from 300 to 600 g/cm2. This multi-purpose pad is ideal for polishing silicon
and compound wafers, and ceramics.
POLYPAS #FP80 is used for both medium- and high-pressure
polishing.
This FP series product provides best results when used in combination
with pad #FP75.This pad provides a high stock removal rate, excellent
flatness, and a long life.
POLYPAS #FP85, manufactured through a special hardening
process, is designed to provide excellent flatness, especially for high-speed,
high-pressure polishing.
This FP series product is also suitable for CMP.
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